SMT ASSEMBLY

Memory module assembly, from board to build.

We assemble memory modules through connected SMT steps, from solder paste printing and placement to reflow, inspection, and board separation. Our DDR3 and DDR4 module examples show the products behind this work.

Our memory module SMT workshopTynsen photo
THE PRODUCTION FLOW

A connected sequence of manufacturing steps.

Depending on the product, assembly may include solder paste printing, component placement, reflow, inspection, and board separation. Process and inspection requirements are set against the target module.

01

Solder paste printing

02

DRAM and component placement

03

Reflow soldering

04

Optical inspection

05

Board separation and testing

BEFORE THE LINE STARTS

Align the parts, board, and build target.

Module manufacturing begins with a defined product. Board revision, component selection, BOM, assembly drawings, quantities, and intended test or acceptance requirements provide the foundation for planning.

Material review

Confirm the PCB revision, DRAM package and organization, other components, and any customer-supplied material.

Process planning

Review stencil, placement, reflow, handling, and inspection needs against the approved module.

Finished-product checks

Define the applicable inspection and functional test approach for the specific module and intended application.

REAL EQUIPMENT

Explore the machines behind the process.

See the Yamaha placement machines, GKG solder paste printer, reflow equipment, AOI, and depaneling equipment used across our module manufacturing process.

Yamaha YSM20R placement machine
PRODUCT EXAMPLES

DDR3 and DDR4 module examples.

The photographs below show DDR3 and DDR4 module examples. For a new build, we confirm the target specifications, materials, and acceptance requirements with you.

DDR3 memory module product photograph

DDR3 example

A DDR3 module example; exact configuration and availability are confirmed for each inquiry.

DDR4 module product photograph

DDR4 example

A DDR4 module example; the target build is defined by the project requirements.

NEXT STEP

Let's discuss
what comes next.

We welcome a conversation about your memory project.

Discuss module manufacturing