Where our services fit your project.
Our services fit defined work on supplied DRAM ICs, memory PCBs, and modules. The right route depends on the actual device, target specification, and acceptance requirements.
When a DRAM IC needs a defined change.
A project may begin with a single component and a clear processing goal. We review the incoming part, intended result, and checks required before work begins.
Solder ball array work
For applicable DRAM packages requiring reballing before assembly, we review the package, pad condition, target array, and inspection criteria.
ExplorePackage marking work
When an existing mark must be removed and a new mark applied, the approved text is checked against the true device information and documented work.
ExploreConfiguration conversion
For selected devices, original organization and target specifications guide feasibility, sample planning, and validation scope.
ExploreWhen several manufacturing stages need to connect.
Memory PCB work and module assembly can be discussed together when a project requires coordination between board revision, DRAM parts, SMT materials, and finished module requirements.
Memory PCB development
Review drawings or design inputs against the target module, parts, and downstream assembly requirements.
ExploreModule SMT assembly
Align the approved BOM, board revision, supplied materials, sample plan, and inspection requirements before production.
ExploreTesting and repair
Use the module model, observed behavior, and available records to define a relevant test or repair scope.
ExploreThe application is defined by the part and its use.
Different devices and systems call for different specifications and checks. We review the target application, key parameters, and acceptance criteria before agreeing on a service scope.
Let's discuss
what comes next.
We welcome a conversation about your memory project.