Identify the device
Confirm the complete part number, package, current organization, marking, and any relevant history of the material.
COMPONENT SERVICES
DRAM IC processing with attention to every step.
Tynsen works across four DRAM IC processing services. The process, inspection requirements, and delivery scope are aligned with the actual device and the project goal.
ILLUSTRATIVE PRODUCT VISUALHOW TO ASSESS A CHIP PROJECT
The part comes before the process.
The same service name can cover materially different jobs. Package construction, incoming condition, target specification, and later assembly requirements influence the processing route and validation plan.
Describe the objective
State whether the purpose is a new solder array, an approved mark, a target organization, a test decision, or a combination of steps.
Set the acceptance basis
Discuss samples, inspection points, applicable tests, and the records needed by your sourcing or engineering team.
01 / REBALLING
Rebuild the solder ball array.
For applicable DRAM ICs requiring a new solder ball array for subsequent assembly, we assess the package, pads, and incoming condition before processing. Target ball requirements, acceptance approach, and any inspection records are agreed for the job.
What helps us assess the work
A full part number, quantity, and clear photos of the existing device help our team evaluate the package and condition efficiently.
What we confirm
The intended assembly, target ball requirements, sample approach, and any necessary inspection criteria are reviewed for the actual package.
What can be handed over
The processed devices and any agreed visual or test records are defined in the project scope.
02 / SURFACE & MARKING
Mechanical grinding and laser remarking.
The existing package mark is mechanically removed, then the approved information is laser marked. We check the actual device information, current mark, and proposed mark before work begins so the new marking does not misrepresent the part’s identity, origin, or condition.
Information to provide
Share clear photos of the current mark, the verified part information, and the exact proposed marking content.
Marking confirmation
The approved text, layout, sample appearance, and identification records can be reviewed before a full run.
Identity remains traceable
Remarking is a surface operation. It does not change the underlying device, its origin, or its true specification.
03 / CONVERSION
Part-specific configuration conversion.
For selected DRAM ICs, our engineering team reviews the original organization, target specification, intended use, and available samples before defining the processing and validation scope. The complete device specifications determine the approach.
Original part
The complete original part number and device data are needed to establish the starting organization and package.
Target part or requirement
The desired organization, system application, and any interchangeability requirements guide the review.
Validation plan
Samples, test conditions, and acceptance criteria are discussed before the conversion route is confirmed.
04 / TESTING
Testing aligned with the device and purpose.
DRAM IC testing can be scoped to incoming or processed parts. We agree on applicable checks, acceptance criteria, and record format for the project. Existing failure descriptions or results help refine the scope.
Before testing
Identify the device, lot or quantity, known issue, and the decision the test result should support.
During scope review
Applicable checks, test conditions, sample size, and acceptance rules are defined for the job.
At handover
The agreed result and record format provide a clear basis for the next engineering or procurement decision.
COMMON QUESTIONS
A clear starting point.
You can contact Tynsen about a single processing step or several connected steps.
Can we request only one step?
Yes. Reballing, remarking, conversion, and testing can be discussed individually.
Can we begin with photos?
Yes. Photos help an initial discussion; reliable part information is needed to confirm the package, organization, and test requirements.
Does remarking change the chip’s identity?
No. The new marking must correspond to the actual device and the approved processing details.
NEXT STEPLet's discuss
Talk with us about IC processing Let's discuss
what comes next.
We welcome a conversation about your memory project.